VMP8000, the new generation high-frequency wafer mass production testing system, has been officially released.
Every iteration and upgrade of optical communication chip technology is built upon rigorous testing and verification as its core foundation.
With the explosion of AI artificial intelligence, the optical communication chip industry has entered a period of rapid development. To meet the challenges of higher bandwidth, lower cost, and higher yield, the testing process for optical communication chips has shifted "upstream." Tests such as bandwidth and eye diagram testing, which were previously only performed during the packaging stage, are now being moved to the wafer level.
To address this change in optical chip testing, Cotest has launched the new generation VMP8000 series high-frequency wafer mass production testing system. With its groundbreaking high-speed testing performance, it helps chip manufacturing enter a more efficient new stage.
Transceiver Dual Testing, Comprehensive and Precise
Designed specifically for optical communication chips, the VMP8000 series supports testing of 6-inch and smaller laser and detector wafers (chips). With high-precision measurement and high-speed stable performance, this testing system comprehensively covers key O-E/E-O/E-E test indicators, providing reliable data assurance for chip R&D and mass production, helping customers improve product performance and yield.
Self-Developed Algorithms, Efficient Testing
Equipped with a high-precision fully automatic coupling component and relying on self-developed core coupling algorithms, Cotest's VMP8000 series high-frequency wafer mass production testing system can quickly adapt to various scenarios, including manual and batch testing, supporting customers throughout the entire R&D cycle from lab to fab.
Flexible Architecture, Continuous Upgrades
The VMP8000 series adopts a modular design. Through different modules, it can be extended to test RF chips or other types of chips in addition to optical chips, adapting to different optoelectronic chip types and technological iterations, reserving ample expansion space for continuously evolving testing needs.
By integrating multiple test modules, the VMP8000 supports tests including but not limited to:
Laser bandwidth and related tests;
Detector bandwidth and related tests;
Eye diagram testing on wafers;
Wafer-level frequency response testing of RF devices (amplifiers, filters, etc.);
Laser relative intensity noise (RIN) testing;
Advanced component dynamic and static testing...
The VMP8000 is not just a solution; it's your reliable partner for achieving technological breakthroughs and accelerating mass production. This test system is now available for pre-order, with the following models:
* Standard model: VMP8000-S, includes VMP8000 probe station main unit + Rohde & Schwarz vector network analyzer + 614 optical mount;
* Customized model: VMP8000-C, supports system configuration with various instruments.
If you have any related needs or require chip testing services, please contact our sales engineers, or send your requirements via email to info@cotest.com.cn.
We will have a live demonstration area at the 26th China International Optoelectronic Exposition, held from September 10th to 12th at the Shenzhen International Convention and Exhibition Center. We welcome partners to visit our booth and have in-depth discussions with our technical team regarding your specific needs.
